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Portable 2008
will bring together engineers and business leaders involved in PID
development, to address and discuss state-of-the-art challenges
related to PIDs. Forum discussions will focus on improving hardware
and software, functionality, physical/mechanical performance,
reliability, and durability. Engineers specializing in electrical,
materials, mechanical, optical, reliability, industrial, and
manufacturing attributes of PIDs will provide valuable insights and
recommendations on improving the quality of PIDs. |
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Polytronic joins researchers,
engineers and scientists from around the world in mid-August 2008 to
share knowledge and experience in Polymeric Materials for
Microelectronic & Photonic Applications (POLY), Adhesives in
Electronics, and Polymeric Electronics Packaging (PEP). The program
will include keynote, invited and contributed presentations, as well
as panel discussions on thermosetting/thermoplastic systems;
adhesives (organic, inorganic, conductive); composites; molding
compounds; fillers; underfills; pastes and films; optical; PCB
materials; thick and thin films; low and high electric materials.
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